Moortec will be exhibiting their market leading In-Chip Monitoring Subsystem IP at the TSMC Europe Open Innovation Platform® Ecosystem Forum & Technology Symposium which are taking place at the Hilton Amsterdam Airport Schiphol in the Netherlands on Monday 23rd & Tuesday 24th of July.
Moortec have also recently announced the availability of their new Internet of Things (IoT) focused embedded monitoring subsystem, targeting TSMC’s 40ULP (Ultra Low Power) process technology.
To support the rapidly evolving IoT landscape, today’s System-on-Chip (SoC) designs require solutions adapted to specific market constraints, which includes power efficiency and device reliability. Moortec’s new monitoring subsystem is developed specifically to physically monitor dynamic and static conditions deep within IoT enabled edge devices.
To find out more about this new smaller scale, lower power IoT focused subsystem as well as Moortec’s range of “off the shelf” monitoring IP on TSMC 28nm, 16nm, 12nm & 7nm, come and meet our team of experts at booth and discuss in person how your advanced node SoC programme can benefit from Moortec’s high performance in-chip sensors. Target applications areas include Datacentre & Enterprise, Automotive, AI, Mobile, Consumer and Telecommunications, which all utilise advanced node CMOS technologies.
Moortec provides market-leading embedded monitoring IP subsystems for today’s technologies and specialise in high accuracy, highly featured embedded Process, Voltage and Temperature (PVT) sensors. Moortec’s IP enables SoC designs to be performance optimised and monitored on a per die basis and offers support for AVS/DVFS.
If you are working on advanced node technologies it is highly likely that your SoC will require monitoring to enhance real-time performance optimisation and lifetime reliability. Understanding how the chip has been made (process) as well as understanding its dynamic conditions (voltage supply and junction temperature) has become a critical requirement for advanced node semiconductor design.
Established in 2005, Moortec provides compelling embedded subsystem IP solutions for Process, Voltage & Temperature (PVT) monitoring, targeting advanced node CMOS technologies from 40nm down to 7nm. Moortec’s in-chip sensing solutions support the semiconductor design community’s demands for increased device reliability and enhanced performance optimisation, enabling schemes such as DVFS, AVS and power management control systems. Moortec provides excellent support for IP application, integration and device test during production. Moortec’s high-performance analog and mixed-signal IP designs are delivered to ASIC and System on Chip (SoC) technologies within the consumer, mobile, automotive, high performance computing and telecommunications sectors. For more information, please visit www.moortec.com, follow us on Twitter and LinkedIn.
If you would like to arrange a meeting at either the TSMC Europe Open Innovation Platform® Ecosystem Forum or Technology Symposium please contact Ramsay Allen on +44 1752 875133 or email: firstname.lastname@example.org