This smaller scale, lower power Internet of Things (IoT) targeted version of Moortec’s embedded in-chip monitoring subsystem, targets TSMC’s 40uLP (Ultra Low Power) process technology.
To support the rapidly evolving IoT landscape, today’s system-on-chip (SoC) designs require solutions adapted to the specific market constraints, which includes power efficiency and device reliability.
Moortec’s new monitoring subsystem is developed specifically to physically monitor dynamic and static conditions deep within IoT enabled edge devices, hence enabling tight control over thermal, voltage supply and operational speed conditions. The product is therefore aimed at enabling chip developers to optimise power performance for their low-power end-use applications.
Moortec’s solution, being the first in its range of IoT targeted products, has been developed for TSMC’s 40nm uLP CMOS technology. By detecting process variability for each chip manufactured and monitoring the dynamic changes to temperature and voltage supply conditions, the IP can be used to enable continuous Dynamic Frequency and Voltage Scaling (DVFS) and Adaptive Voltage Scaling (AVS) optimisation schemes. The subsystem delivery also includes a sophisticated PVT Controller with AMBA APB interfacing, supporting multiple monitor instances, statistics gathering, production test access support as well as other compelling features.