Moortec Semiconductor will be exhibiting at the TSMC
2017 Taiwan Technology Symposium Ecosystem Pavilion on Thursday 25th May. The event is taking place at the Ambassador Hotel Hsinchu so why not come
and meet us at booth #25 and discuss in person how your advanced node System on
Chip (SoC) programme can benefit from Moortec’s high performance In-Chip
Moortec provide market-leading embedded monitoring
IP subsystems for today’s technologies and specialise in high accuracy, highly
featured embedded Process, Voltage and Temperature (PVT) sensors. Moortec’s IP
enables SoC designs to be performance optimised and monitored on a per die
basis and offers support for AVS/DVFS.
If you are working on advanced node technologies it
is highly likely that your SoC will require monitoring to enhance real-time
performance optimisation and lifetime reliability. Understanding how the chip
has been made (process) as well as understanding its dynamic conditions
(voltage supply and junction temperature) has become a critical requirement for
advanced node semiconductor design.
Moortec offers a range of ‘off the shelf’ monitoring
IP on TSMC 40nm, 28nm, 16nm and have recently announced the availability of
their design kit on TSMC’s 7nm process.
are also the current holders of the TSMC Open Innovation Platform Partner of
the Year Award for the New IP category.
in 2005 Moortec provides compelling embedded subsystem IP solutions for
Process, Voltage & Temperature (PVT) monitoring, targeting advanced node
CMOS technologies from 40nm down to 7nm. Moortec’s in-chip sensing solutions
support the semiconductor design community’s demands for increased device
reliability and enhanced performance optimization, enabling schemes such as
DVFS, AVS and power management control systems. Moortec provides excellent support
for IP application, integration and device test during production.
If you would like to arrange a meeting at the event please
contact Ramsay Allen on +44 1752 875133 or email: email@example.com
For more information please