Moortec Semiconductor, leading supplier
of embedded monitoring and optimisation IP, are proud to announce its
membership in TSMC’s Hard IP Alliance, a part of TSMC’s Open Innovation
Platform®. Alliance membership
will allow Moortec to leverage TSMC’s advanced technologies with its high
performance analog IP and subsystem solutions used for monitoring and
controlling conditions on-chip for performance and reliability purposes.
The TSMC IP
Alliance Program includes leading IP companies, providing the semiconductor
industry’s largest catalog of silicon-verified, production-proven and
foundry-specific intellectual property (IP). Moortec believes
there is a critical need for reliable on-chip monitoring, especially thermal
monitoring, for semiconductor geometries of 28-nanometer (nm) and FinFET.
transistor geometries shrink and both gate and power densities per unit area
increase, designers are seeking ways in which their designs can be optimised
dynamically and ways in which device lifetime and reliability can be improved,”
said Stephen Crosher, Managing Director of Moortec Semiconductor.
“We are very excited, as being a member of the Alliance will enable us to
collaborate more closely with TSMC which will aid in the design of our
compelling IP products and further improve our support to customers.”
“TSMC’s work with Moortec Semiconductor has been
very positive for our customers,” said Suk Lee, TSMC Senior Director, Design
Infrastructure Marketing Division. “We
are pleased to have them participating in our IP Alliance program.”