Moortec Semiconductor, leading supplier of embedded monitoring and optimisation IP, are proud to announce its
membership in TSMC’s Hard IP Alliance, a part of TSMC’s Open Innovation Platform®. Alliance membership
will allow Moortec to leverage TSMC’s advanced technologies with its high performance analog IP and subsystem solutions used for monitoring and controlling conditions on-chip for performance and reliability purposes.
The TSMC IP Alliance Program includes leading IP companies, providing the semiconductor industry’s largest catalog of silicon-verified, production-proven and foundry-specific intellectual property (IP). Moortec believes
there is a critical need for reliable on-chip monitoring, especially thermal monitoring, for semiconductor geometries of 28-nanometer (nm) and FinFET.
“As transistor geometries shrink and both gate and power densities per unit area increase, designers are seeking ways in which their designs can be optimised dynamically and ways in which device lifetime and reliability can be improved,” said Stephen Crosher, Managing Director of Moortec Semiconductor. “We are very excited, as being a member of the Alliance will enable us to collaborate more closely with TSMC which will aid in the design of our
compelling IP products and further improve our support to customers.”
“TSMC’s work with Moortec Semiconductor has been very positive for our customers,” said Suk Lee, TSMC Senior Director, Design Infrastructure Marketing Division. “We are pleased to have them participating in our IP Alliance program.”