Moortec are proud to have collaborated with the following companies:
UltraSoC is a pioneering company that delivers monitoring and analytics technology for use in the silicon chips (SoCs) that power today’s industrial, consumer and professional electronic products. The Company is headquartered in Cambridge, UK, and is backed by Octopus Ventures. UltraSoC’s technology looks inside the whole SoC, in an transparent and non-intrusive way, to understand exactly what is happening anywhere in that chip. The company is headquartered in Cambridge, United Kingdom.
The collaboration enables a new generation of Process, Voltage and Temperature (PVT) sensor sub-systems. By integrating UltraSoC’s digital monitoring and optimization capabilities, with Moortec’s industry-leading PVT products this enables powerful, chip-wide infrastructure to improve SoC performance and reliability. The partnership enables ICs to be equipped with advanced features such as built-in preventive maintenance, load balancing to reduce failures and better control of power consumption for longer battery life.
For more information about UltraSoC visit www.ultrasoc.com
Sonics, Inc. (San Jose, Calif.) is the trusted leader in on-chip network (NoC) and power-management technologies used by the world’s top semiconductor and electronics product companies, including Broadcom®, Intel®, Marvell®, MediaTek, and Microchip®. Sonics was the first company to develop and commercialize NoCs, accelerating volume production of complex systems-on-chip (SoC) that contain multiple processor cores. Sonics’ ICE-Grain™ Family is the IP industry’s first complete Energy Processing Unit (EPU), which enables rapid development of SoC power management subsystems. Sonics holds approximately 150 patent properties supporting customer products that have shipped more than four billion SoCs.
The collaboration integrates the companies’ products to provide advanced power management techniques to system-on-chip (SoC) and MCU designers. The partnership couples Sonics’ ICE-P3™ with Moortec’s compelling Temperature Sensors to enable temperature-compensated, dynamic voltage and frequency scaling (DVFS) in chip designs intended for power-sensitive devices such as mobile/handheld and the Internet of Things (IoT). The partnership solution is available immediately.
For more information about Sonics, Inc. visit www.sonicsinc.com
Moortec are proud members of TSMC’s Hard IP Alliance, a part of TSMC’s Open Innovation Platform®. Alliance membership which allows Moortec to leverage TSMC’s advanced technologies with its high performance analog IP and subsystem solutions used for monitoring and controlling conditions on-chip for performance and reliability purposes.
The TSMC IP Alliance Program includes leading IP companies, providing the semiconductor industry’s largest catalog of silicon-verified, production-proven and foundry-specific intellectual property (IP).