Moortec are proud to have collaborated with the following companies:
Moortec are proud members of TSMC’s Hard IP Alliance, a part of TSMC’s Open Innovation Platform®. Alliance membership allows Moortec to leverage TSMC’s advanced technologies with its high performance analog IP and subsystem solutions used for monitoring and controlling conditions on-chip for performance and reliability purposes.
The TSMC IP Alliance Program includes leading IP companies, providing the semiconductor industry’s largest catalog of silicon-verified, production-proven and foundry-specific intellectual property (IP).
Moortec are proud to collaborate with Arm to deliver our TSMC 7nm FinFET In-Chip Monitoring technology to the new Arm® Neoverse™ N1 System Development Platform (SDP). As market leaders, Moortec support integration and utilization of its process, voltage, and temperature (PVT) sensing subsystem technology to the platform, enabling the next-generation cloud-to-edge infrastructure, powered by Arm Neoverse solutions. The Neoverse N1 SDP is the industry’s first 7nm infrastructure-specific system development platform, enabling asymmetrical compute acceleration through the CCIX interconnect architecture.
The collaboration between Moortec and Arm achieved a solution capable of dynamically sensing in-chip conditions to help optimize power consumption, maximize system speed, and enhance device reliability. The Neoverse N1 SDP is available to hardware and software developers for hardware prototyping, software development, system validation, and performance profiling/tuning.
UltraSoC is a pioneering company that delivers monitoring and analytics technology for use in the silicon chips (SoCs) that power today’s industrial, consumer and professional electronic products. The Company is headquartered in Cambridge, UK, and is backed by Octopus Ventures. UltraSoC’s technology looks inside the whole SoC, in an transparent and non-intrusive way, to understand exactly what is happening anywhere in that chip.
The collaboration enables a new generation of Process, Voltage and Temperature (PVT) sensor sub-systems. By integrating UltraSoC’s digital monitoring and optimization capabilities, with Moortec’s industry-leading PVT products this enables powerful, chip-wide infrastructure to improve SoC performance and reliability. The partnership enables ICs to be equipped with advanced features such as built-in preventive maintenance, load balancing to reduce failures and better control of power consumption for longer battery life.
For more information about UltraSoC visit www.ultrasoc.com