Interesting article by Ann Steffora Mutschler, executive editor at Semiconductor Engineering.
The Evolving Thermal Landscape
“How finite element analysis and other technologies are being used to reduce risk and uncertainty of thermal impacts in advanced packaging.”
“Managing heat in chips is becoming a precision balancing act at advanced nodes and with advanced packaging. While it’s important to ensure that temperatures don’t rise high enough to cause reliability problems, adding too much circuitry to control heat can reduce performance and lower energy efficiency.”
Read the full article:
For more information about Moortec and how our Temperature Sensor IP can address heat issues on 28nm and FinFET visit: www.moortec.com