Last week Moortec exhibited at the 55th Design Automation Conference which to place at the Moscone Centre West in San Francisco.
A delegation of Moortec team members made the trip from the UK to attend the 3 day event which is the premier conference devoted to the design and automation of electronic systems (EDA), embedded systems and software (ESS), and intellectual property (IP).
During the event Moortec announced the availability of a smaller scale, lower power, Internet-of-Things (IoT) focused embedded monitoring subsystem, targeting TSMC’s 40ULP (Ultra Low Power) process technology.
To support the rapidly evolving IoT landscape, today’s System-on-Chip (SoC) designs require solutions adapted to specific market constraints, which includes power efficiency and device reliability. Moortec’s new monitoring subsystem is developed specifically to physically monitor dynamic and static conditions deep within IoT enabled edge devices, hence enabling tight control over thermal, voltage supply and operational speed conditions. The product is therefore aimed at enabling chip developers to optimise power performance for their low-power end-use applications.
Moortec’s IP solution, being the first in its range of IoT targeted products, has been developed for TSMC’s 40nm ULP CMOS technology. By detecting process variability for each chip manufactured and monitoring the dynamic changes to temperature and voltage supply conditions, the IP can be used to enable continuous Dynamic Frequency and Voltage Scaling (DVFS) and Adaptive Voltage Scaling (AVS) optimisation schemes. The subsystem delivery also includes a sophisticated PVT Controller with AMBA APB interfacing, supporting multiple monitor instances, statistics gathering, production test access support as well as other compelling features.
Moortec also be presented the TSMC OIP Theatre at DAC. The OIP Theatre allowed TSMC Ecosystem members to demonstrate the collaborative value and benefits of TSMC’s Open Innovation Platform. Moortec’s presentation was entitled “Optimisation and Reliability Enhancement for FinFET Design Applications” and will be presented by CEO Stephen Crosher.
DAC was also a great opportunity to get together with some of our International Representatives who do a great job promoting Moortec’s In-Chip Monitoring IP on a global level.
Established in 2005, Moortec provides compelling embedded subsystem IP solutions for Process, Voltage & Temperature (PVT) monitoring, targeting advanced node CMOS technologies on 40nm, 28nm, 16nm, 12nm and 7nm. Moortec’s in-chip sensing solutions support the semiconductor design community’s demands for increased device reliability and enhanced performance optimisation, enabling schemes such as DVFS, AVS and power management control systems. Moortec provides excellent support for IP application, integration and device test during production. Moortec’s high-performance analog and mixed-signal IP designs are delivered to ASIC and System on Chip (SoC) technologies within the consumer, mobile, automotive, high performance computing and telecommunications sectors.